JPH0731556Y2 - 伸縮可能な可撓性印刷配線板 - Google Patents
伸縮可能な可撓性印刷配線板Info
- Publication number
- JPH0731556Y2 JPH0731556Y2 JP1990084153U JP8415390U JPH0731556Y2 JP H0731556 Y2 JPH0731556 Y2 JP H0731556Y2 JP 1990084153 U JP1990084153 U JP 1990084153U JP 8415390 U JP8415390 U JP 8415390U JP H0731556 Y2 JPH0731556 Y2 JP H0731556Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- flexible
- intermittent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 6
- 239000012787 coverlay film Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990084153U JPH0731556Y2 (ja) | 1990-08-08 | 1990-08-08 | 伸縮可能な可撓性印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990084153U JPH0731556Y2 (ja) | 1990-08-08 | 1990-08-08 | 伸縮可能な可撓性印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0442763U JPH0442763U (en]) | 1992-04-10 |
| JPH0731556Y2 true JPH0731556Y2 (ja) | 1995-07-19 |
Family
ID=31632402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990084153U Expired - Fee Related JPH0731556Y2 (ja) | 1990-08-08 | 1990-08-08 | 伸縮可能な可撓性印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0731556Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7022345B2 (ja) * | 2018-11-22 | 2022-02-18 | 株式会社オートネットワーク技術研究所 | 接続モジュール |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593567U (ja) * | 1982-06-29 | 1984-01-11 | 松下電器産業株式会社 | 両面フレキシブルプリント基板 |
| JPS6163864U (en]) * | 1984-09-29 | 1986-04-30 | ||
| JPH02278785A (ja) * | 1989-04-19 | 1990-11-15 | Seiko Epson Corp | フレキシブル回路基板 |
-
1990
- 1990-08-08 JP JP1990084153U patent/JPH0731556Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442763U (en]) | 1992-04-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |